Products & Technologies


In-line non-destructive inspection and metrology for the semiconductor and micro-electronic industries.


The Onyx dedicated for BEOL applications is a novel fully automated in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry.

The unique hybrid configuration of the ONYX enables providing a solution to challenging applications through various analytical approaches and effective SW algorithms:
  • Metal film stacks thickness measurements
  • Feature dimensions measuring
  • Detection and analysis of voids or missing layers
  • XRF thickness standards verification
  • Detecting specific miss-processing out of a multi-variable metrology application
  • Algorithm compensation for parameter variations of a film stack

The ONYX integrates enhanced ED-XRF micro-spot analysis, 3D scanning and 2D microscope technologies, and a unique integrative software to operate in one fully automated system, serving in-line and non-destructive applications. The result of this unique integration is a synergic effect that enables dealing with complex applications in the following manner: Geometrical parameters can be easily monitored with high throughput and precision of the optical components and include features such as: width, length, height, shape and surface. By measuring with the enhanced ED-XRF component, material and volumetric parameters can be obtained, such as film thickness and composition.

The ONYX’s unique triple-mode technologies and capabilities, is designed to meet both fast in-line and in-depth metrology challenges, without interrupting the process flow. Enabling several physical parameters to be measured across the wafer, wafer to wafer, and lot to lot - ensures the process is controlled. The ONYX is dedicated and designed to serve multiple in-line and non-destructive metrology and inspection needs in the semiconductor and related micro-electronics industries.  

Technical Specifications

System Parameters Specifications Comments
Metrology type Non-destructive ED-XRF and optical techniques Self-test monitoring system  
Wafer size Up to 300mm    
X/Y stages resolution 0.5µm Feature contour
Z stage resolution 50nm  
Back side camera Easy calibration feature Auto calibration mode
Sample handling Magazine robot  
Automation Full wafer capability Single to dual automatic loader
Navigation Precise stages complemented with an image recognition algorithm Sub-micron fast navigation to single feature center
SW user interface Ease-of-use recipe creation and maintenance Auto tool health monitoring and auto calibration

XRF beam orientation Vertical incidence micro-spot XRF  
X-ray tube energy 50KV, 50W  
Detector type Silicon drift detectors (SDD) Optional: light element detector
Detector resolution 125eV +/- 5eV With large solid angle
X-ray beam spot size (FWHM@8 KeV) <10μm with poly-capillary optics
Small / Regular capillary:
Sn - 7μm / 17μm
Cu- 10μm / 23μm
Small spot for high energy elements

Variety of spot sizes available
Detectable range of elements All elements down to C(6)  
Multi-channel analyzer (MCA) High efficiency Larger than1 million photons per second

2D Microscope

2D Microscope Resolution: 5 Megapixel
lateral 0.1 μm
Sensor Technology: CCD Color
Sub-micron navigation with
pattern recognition
Magnification (optical microscope) X2, X10 Option: X20, X50 and other

3D Scanner
3D Scanner Ultra-fast 3D geometrical parameter
extraction i.e. height, shape, structure
Vertical resolution: 100 nm
Insensitive to material absorption
Working distance   All materials and any type of


Film Stack
The unique triple-mode technology offers several film stack critical parameters measurements and quantities
Ultra-Thin Films Measurement
Down to a single Angstrom (Å) based on an enhanced ED-XRF technique
Light Elements Detection
Elemental analysis of low Z elements is performed with a state-of-the-art light elements detector
UBM/RDL: Thickness & Composition Monitoring
Analysis of multi-stack structures and thick mono-layers
Bump Inspection - Composition & Height
The hybrid solution provides quick and reliable location of bump and wafer defects
Real Time Review - Detection & Metrology
Integrated 3D and 2D metrology and inspection in a single system