Press Release

XwinSys Publishes a New Article in Solid State Magazine

Unique In-line and non-destructive hybrid technology – a new standard for the semiconductor industry

July 6th 2016

XwinSys Technology Development Ltd. (“XwinSys”), is publishing an article describing its novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced X-ray and optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry.

The abstract will be published in the July 2016 edition of Solid State Technology, associated with SEMICON West 2016 exhibition, also available

XwinSys’s unique and patented multi-mode technology system meets both fast in-line and in-depth metrology challenges, without interrupting the process flow.  

Doron Reinis, Chief Operating Officer stated, “This is a case where the whole is greater than the sum of its parts - the integrated sensors create an innovative holistic approach to problem solving and product monitoring – a disruptive technology that replaces the need for off-line analytical tasks”

Bruce Rowlands, Chairman and Chief Executive Officer, added, “XwinSys is ideally positioned to supply a revolutionary solution to a critical need in the newly emerging field of 3D interconnects in 3D integrated circuit stacks.”  

XwinSys will be presenting the hybrid technology and its portfolio of solutions at SEMICON West 2016, the world’s marketplace for microelectronics innovation and largest conference and exhibition for the semiconductor industry. The Conference and Exhibition is being held at the Moscone Center, San Francisco from July 12th through July 14th, 2016. XwinSys will be exhibiting in the South Hall, booth # 2245.