Press Release

XwinSys will be participating in SEMICON West 2016

Patented Hybrid In-Line Metrology System to be Featured

June 15th 2016

XwinSys Technology Development Ltd. will be participating in SEMICON West 2016, the world’s marketplace for microelectronics innovation and largest conference and exhibition for the Semiconductor industry. The Conference and Exhibition is being held at the Moscone Center in San Francisco on July 12 - 14, 2016. XwinSys will be exhibiting at the South Hall, booth # 2245.

Doron Reinis, Chief Operating Officer of Eurocontrol stated, “The global industry looks to SEMICON West for the most up-to-date information on the tools, technologies, and trends driving the design, manufacture, and business of microelectronics. XwinSys is proud and looking forward to present for the first time its innovative in-line non-destructive inspection and metrology analysis solution for the semiconductor industry. XwinSys’s unique hybrid configured system enables a wide range of analysis of advanced features with unsurpassed precision; height and critical dimension monitoring, volume measurement, 3D structure analysis, misprocess voids, surface defects, thin film multi-layer analysis and materials composition inspection. SEMICON West is the one event that connects the extended supply chain in one place at one time. We are looking forward to the opportunity to meet and connect with our customers, partners and some of the best minds in the manufacturing and packaging business.”