Press Release

XwinSys Receives United States Patent

United States Patent Office Grants Process Patent

May 12th 2016

XwinSys Technology Development Ltd., has been granted a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump.

This process patent protects XwinSys ONYX and AGATE systems which are non-destructive in-line metrology systems designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their hybrid configuration of X-Ray analysis, automated 3D microscope and 2D image processing enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.

Bruce Rowlands, Chairman and CEO stated, "The acceptance of this patent application by the United States Patent and Trademark Office is a significant milestone for our subsidiary XwinSys. This invention in the field of wafer inspection is new for its ability to detect the existence of voids in a bump and to calculate voids volume along with other critical dimensions relative to bump inspection, such as bump height, pillar height and solder composition ensuring overall product quality “.