Newsletters & Application Notes

XwinSys Newsletters & Application Notes

Copper Pillar Bumps Layers Thickness
5 seconds Shot for full feature parameters, The Multi-Stack Application for bumps, Accurate and repeatable results
Onyx Hybrid Metrology - System Automatic Health Monitoring - May, 2017
Keep the tool calibrated and stable so that all measurement recipes will yield consistent results over a long period of time.
Newsletter no.1 August 2016
- XwinSys at SEMICON West 2016 - XwinSys published another article in Solid State Technology magazine - Meet our leadership team
Application Note - no.1 - Oct.16
In-Line Single wafer pass capability of detecting and analyzing process issues provides a cost effective method implementing a hybrid metrology sensor capability. Detection and analysis with a small beam spot are done in concert, on one system is XwinSys competitive advantage.