Press Release

XwinSys Recent Press Releases

    Unique In-line and non-destructive hybrid technology – a new standard for the semiconductor industry
    Patented Hybrid In-Line Metrology System to be Featured
    United States Patent Office Grants Process Patent
    NMT: Noise-reduced Multilayer Thin-film Measurement System a Revolutionary Tool
    Significant Progress in Bumps Inspection System for Semiconductor Manufacturing
    -Office of the Chief Scientist of Israel Supports Wafer Bumps Inspection and Measurement System-
    -Partnership Will Bring New Verification Technology to the Semiconductor Industry-