Products & Technologies


Non-destructive inspection and metrology for the semiconductor and micro-electronic industries.


The Agate combines hybrid configuration- X-Ray, 2D microscope and 3D scanner, allowing significant advantages:
  • Height and critical dimension (CD) monitoring
  • Volume measurement
  • 3D structure analysis such as misprocess, voids and surface defects
  • Thin film multi-layer analysis
  • Materials composition inspection

The advent of X-Ray technology for semiconductor metrology reduces the need for entrenched destructive methodologies requiring sample preparation.

XRF is capable of analyzing localized 3D structures and thus has an advantage over technologies which are surface sensitive only (including XRR, XRD and optics).

Technical Specifications

System Parameters Specifications Comments
Metrology type Non-destructive ED-XRF and
optical techniques
Self-test monitoring system  
Wafer size Up to 300mm    
X/Y stages resolution 0.5µm  
Z stage resolution 50nm  
Back side camera Easy calibration feature Auto calibration mode
Sample handling Manual loading    
Automation Full wafer capability 300mm and smaller
Navigation Precise stages complemented
with image recognition algorithm
Sub-micron fast navigation to single feature center
SW user interface Ease-of-use recipe creation and maintenance Auto tool health monitoring and auto calibration

XRF beam orientation Vertical incidence micro-spot XRF  
X-ray tube energy 50KV, 50W  
Detector type Silicon drift detectors (SDD) Optional: light element detector
Detector resolution 125eV +/- 5eV With large solid angle
X-ray beam spot size
(FWHM@8 KeV)
<10μm with poly-capillary optics
Small / Regular capillary:
Sn - 7μm / 17μm
Cu- 10μm / 23μm
Small spot for high energy elements

Variety of spot sizes available
Detectable range of elements All elements down to C(6)  
Multi-channel analyzer (MCA) High efficiency Larger than1 million photons per second

2D Microscope
2D Microscope Resolution: 5 Megapixel
lateral 0.1 μm
Sub-micron navigation with 
pattern recognition

3D Scanner
3D Scanner Ultra-fast 3D geometrical
parameter extraction
i.e. height, shape, structure
Vertical resolution: 100 nm
Insensitive to material absorption
(optical microscope)
X2, X10 Option: X20, X50 and other
Working distance 150μm / 300μm / 1400μm  


Film Stack
The unique triple-mode technology offers several film stack critical parameters measurements and quantities
Ultra-Thin Films Measurement
Down to a single Angstrom (Å) based on an enhanced ED-XRF technique
Light Elements Detection
Elemental analysis of low Z elements is performed with a state-of-the-art light elements detector
UBM/RDL: Thickness & Composition Monitoring
Analysis of multi-stack structures and thick mono-layers
Bump Inspection - Composition & Height
The hybrid solution provides quick and reliable location of bump and wafer defects
Real Time Review - Detection & Metrology
Integrated 3D and 2D metrology and inspection in a single system